Electronic Design & Development ED2 Corp
AGPT™ enables more functionality and smaller footprints; it facilitates cost savings and drives advanced semiconductor technologies in various applications. Our technology enables integration of state-of-the art medical and ag sensors, photonics, optics, digital, RF, electronics, & space solutions.
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"Electronic Design & Development ED2 Corp is a pioneering company in advanced manufacturing, aerospace, agtech, mobility, semiconductors, and smart cities. Powered by AGPT™ (Advanced Glass Packaging Technology), our Heterogeneous Integration solutions enable more functionality and significantly smaller footprints, driving advanced semiconductor technologies across various applications. With a focus on Passives, Packaging, and Multi Chip Modules (MCMs), our products boast excellent thermal, electrical, and optical properties. Passives include distributed, lumped element, and waveguide filters, while our Packaging technology supports performance up to 100GHz with an SMT interface. Leveraging AGPT™, our MCMs enable multi-chip, multi-layer integration with ultra-fine dimensions, zero temperature variation, vibration insensitivity, low-cost hermetical sealing, and innovative thermal management. Our technology revolutionizes the integration of cutting-edge medical and ag sensors, photonics, optics, digital, RF, electronics, and space solutions, driving innovation and efficiency in diverse industries."
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