APAC Summit 2019

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APAC Summit 2019
May 29, 2019
9:00AM - 6:00PM
Marina Bay Sands Singapore, 10 Bayfront Avenue Level 5, Grand Ballroom Singapore, 018956
The Plug and Play APAC Summit is a spectacle showcasing the best we have to offer in Open Innovation in the Asia Pacific region. This is the first major event we’re doing in Southeast Asia, and prepare to be amazed by insights from our corporate partners as well as an array of cool technologies from our curated set of startups, as we give you a glimpse into how our Open Innovation platforms benefit our stakeholders in their innovation journey. Bringing together corporations, startups, government agencies, and venture capital firms across multiple different countries, this event will be a good opportunity for attendees to find out more about how our Open Innovation platforms have been helping our stakeholders in achieving their innovation targets. 

At this inaugural event, participate in our Fintech and Insurtech Batch 1 Expo, and also listen to domain experts from the areas of Mobility & IoT, Supply Chain & Logistics and Travel & Hospitality share more about how they’re working with startups to grow their innovation efforts. We are also inviting a curated set of startups under these verticals, so prepare to interact with them to explore new partnership opportunities.

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