APAC Summit 2.0

Asia's Biggest Open Innovation Platform

APAC Summit 2.0
Nov. 27, 2019
9:00AM - 6:00PM
10 Bayfront Ave, Singapore, S018956

The biggest open innovation platform is back! Plug and Play APAC is once again proud to present APAC Summit 2.0! Showcasing the best of the innovation ecosystem in Asia, the summit will feature 50 of our curated startups, 15+ industry leading speakers and 22 of our corporate innovation partners. This conference hosted by Plug and Play Asia Pacific will bring together some of the largest corporates from the industry, best of tier startups and other stakeholders from our ecosystem. The event will provide a glimpse into how our open innovation platforms benefits our stakeholders in their innovative journey as well as exciting startup pitches showcasing their technologies on stage.

For this invitation-only full day conference, we look to explore what is next in Fintech, Insurtech, Travel, Mobility and Smart Cities. The day will be packed with Keynotes, Panel Discussion between industry leaders and startup pitches. See you there!

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