The Next Generation of Food Packaging

Sustainable and Waste-free

The Next Generation of Food Packaging
Nov. 17, 2020
8:00AM - 9:30AM PST
The Next Generation of Food Packaging
Nov. 17, 2020
8:00AM - 9:30AM PST

Plastic packaging and other preservation alternatives have increased our ability to store and transport food more efficiently, yet leave behind a large waste stream that is filling our oceans, landfills, and atmosphere.

The world’s largest food manufactures have identified packaging innovation as one of the biggest priorities of this decade to build a more sustainable future. The Chicago ecosystem, often called 'the Silicon Valley of Food production' is contributing actively to this change.

In this interactive panel discussion, Ocean Spray® Cranberries, The Hershey Company, TerraCycle, and The Polsky Center at the University of Chicago will come together to explore innovative packaging solutions that address food waste, food preservation, and food safety.

Agenda

  • 08:00 - 08:10 AM:
    Opening remarks
  • 08:10 - 09:00 AM:
    Panel Discussion
  • 09:00 - 09:30 AM:
    Open Q&A Session
  • 09:30 - 09:35 AM:
    Closing Remarks

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